Low temperature bonding

Nowadays, 100 % glass lab-on-a-chips are manufactured with a high temperature bonding. The main constraint is the required high temperature for the bonding (Pyrex transition temperature = 700°C/ Fused silica transition temperature = 1100°C).  High temperature bonding makes instrumentation or embedded technologies delicate because only high temperature fusion materials can potentially be integrated on chips.

Exclusive low temperature glass bonding technology for microfluidic chip. Allow to integrate thermodegradable materials.

Exclusive low temperature glass bonding technology for microfluidic chip. Allow to integrate thermodegradable materials.

Klearia overcomes a major technological limitation by bonding at a low temperature between 100°C and 300°C. Low temperature bonding (≤300°C) allows to integrate more materials for embedded technologies. Thus, Klearia is capable, besides ITO, Pt, Au and Cu, to integrate termodegradable materials like carbon, nanostructured gold, etc.