© 2019 KLEARIA. All Rights Reserved

Custom made-services

 

We offer experience in designing and developing customized microfluidic chip tailored to your needs. 

 

You can beneficiate of:

  • expertise and accompaniment

  • support from conception to fabrication

  • personalized services

  • responsiveness and care to details

 

Depending on your needs, dimensions, channel depths, design, applications...

 

1) Choice of substrate characteristics

• Glass chip advantages

• Chip dimensions

 

2) Design and conception

• Channel design

• Numerical file adaptation

 

3) Fabrication Process

• Proceeding steps

• Channel profile

• Multi level etching

• Electrodes integration

For more information, do not hesitate to contact us.

  • Microchannel depth: 50nm to 200µm

  • Multi levels depth

  • Chip Size: up to 75mm x 75mm

  • Thickness for the structured substrate: 300µm, 500µm, 1mm and 2mm

  • Thickness for the cover substrate: 300µm, 500µm, 1mm and 2mm

  • Holes diameter (inlets/outlets): 0.5 to 2mm

100% glass is ideal for microfluidics

Klearia controls and applies conventional methods of glass microstructuring for microfluidics. Glass is a material of choice for microfluidics because of its advantageous properties:

  • Chemical inertia (except hydrofluoric acid derivatives),

  • Optical transparency,

  • Low autofluorescence

  • Strength (high Young’s modulus allowing to inject several bars without appreciable deformation)

  • Adapted to prototyping and mass production,

  • Low contamination: non-porous material,

  • Stable in time: recurrent handling and easy cleaning.

Materials Substrates

Depending on your needs (optical transparency, operating temperature, cost …), we can provide you with microfluidic chips in various types of glass:

  • Fused Silica

  • Pyrex

  • D263

  • Borofloat 33

This list is not exhaustive. For specific needs, do not hesitate to contact us.

Equipment we have allows us to use substrates maximum size of 4 inches (about 10 centimeters in diameter). The thicknesses of conventional substrates are 300 or 500 microns, so the final chip is between 600 and 1000μm thick. Other substrates dimensions are possible on your request.

Contact us to study your constraints.

Glass Microstructuring

Our devices are mainly wet etched (hydrofluoric acid HF). This process leads to a typical isotropic etching:

Technical capabilities

 

The maximum depth is half of the microchannel width.

Typical sizes that we engrave range from tens of nanometers to hundreds of microns.

Thin coatings compatible
 

We developed a technique to integrate thin coatings compatible with our glass low temperature bonding technology.

We can deposit and structure metal coatings (Au, Pt,…), dielectric coatings (aSi, SiNx, ITO …), carbon coatings (aC-N ) to make microelectrodes. Those elements can be integrated into canal(s), on canal(s) edges, under the canal (covered with a layer of insulation) according needs of your project.

With our low temperature sealing technology, it is now possible to integrate multilayer materials with heterogeneous expansion coefficients, nanostructured materials, thermodegradable materials … For more information about our capabilities, please contact us.

 

Electrochemical sensor LabInGlass® kit

A microfluidic eKIT ready to use is also available for electrochemical assays.

 

eKIT contains:

 

 - 1 Analytical Chemistry standard chip = AK

 - 1 Connect In Glass = CIG

 - 1 Electrical Connect In Glass = eCIG

 - Accessories: tubing...

The AK glass chip is composed of one microfluidic channel with one set of 3 electrodes (working electrode WE, counter electrode CE and reference electrode RE).