100% glass is ideal for microfluidics
Klearia controls and applies conventional methods of glass microstructuring for microfluidics. Glass is a material of choice for microfluidics because of its advantageous properties:
- Chemical inertia (except hydrofluoric acid derivatives),
- Optical transparency,
- Low autofluorescence
- Strength (high Young’s modulus allowing to inject several bars without appreciable deformation)
- Adapted to prototyping and mass production,
- Low contamination: non-porous material,
- Stable in time: recurrent handling and easy cleaning.
Depending on your needs (optical transparency, operating temperature, cost …), we can provide you with microfluidic chips in various types of glass:
- Fused Silica
- Borofloat 33
This list is not exhaustive. For specific needs, do not hesitate to contact us.
Equipment we have allows us to use substrates maximum size of 4 inches (about 10 centimeters in diameter). The thicknesses of conventional substrates are 300 or 500 microns, so the final chip is between 600 and 1000μm thick. Other substrates dimensions are possible on your request.
Contact us to study your constraints.
Our devices are mainly wet etched (hydrofluoric acid HF). This process leads to a typical isotropic etching:
The maximum depth is half of the microchannel width.
Typical sizes that we engrave range from tens of nanometers to hundreds of microns.
For more information, do not hesitate to contact us.
Several levels of engravings on a single chip are available via our custom-made services to adapt the product to your needs and constraints.
Instrumentation and Bonding
We developed a technique to integrate thin coatings compatible with our glass low temperature bonding technology.
We can deposit and structure metal coatings (Au, Pt,…), dielectric coatings (aSi, SiNx, ITO …), carbon coatings (aC-N ) to make microelectrodes. Those elements can be integrated into canal(s), on canal(s) edges, under the canal (covered with a layer of insulation) according needs of your project.
With our low temperature sealing technology, it is now possible to integrate multilayer materials with heterogeneous expansion coefficients, nanostructured materials, thermodegradable materials … For more information about our capabilities, please contact us.